Intel is a leading technology company specializing in semiconductor manufacturing. The Packaging Module Development Engineer will contribute to the development of advanced packaging technologies and collaborate with cross-functional teams to optimize assembly processes and equipment for high-volume manufacturing.
Responsibilities
- Developing First Level/Second Level Interconnect (FLI/SLI) and Thermal solutions to support Intel's future packaging platforms
- Collaborating with multifunctional and cross-organizational teams to develop assembly equipment and optimize assembly processes for quality, reliability, cost, yield, productivity, and manufacturability
- Innovating next generation equipment, materials, and fabrication processes to enhance semiconductor packaging capabilities at scale
- Managing equipment development, including pathfinding, new equipment definition, equipment selection, technology development, and high-volume manufacturing
- Managing projects to meet product development timelines
- Applying formal education and judgment to solve technical problems
- Providing sustaining support for equipment performance and process health in high-volume manufacturing
- Responding promptly to foundry customer requests and events
Skills
- PhD degree in Mechanical Engineering, Materials Science, Electrical Engineering, Physics / Applied Physics, or a related field; OR
- Master's degree in mechanical engineering, Materials Science, Electrical Engineering, Physics / Applied Physics, or a related field
- Candidates who are within four (4) months of completing the required degree are eligible to apply
- Minimum 1+ years of experience in the following: Mechanical design, equipment development, or manufacturing systems, preferably within semiconductor or advanced manufacturing environments
- Strong experimental background, including hands-on laboratory or prototype development experience
- At least one first-author publication in a peer-reviewed technical journal for PhD candidates
Benefits
- Competitive pay
- Stock bonuses
- Benefit programs which include health, retirement, and vacation
Company Overview
Intel designs, manufactures and sells computer components and related products for business and consumer markets. It was founded in 1968, and is headquartered in Santa Clara, California, USA, with a workforce of 10001+ employees. Its website is http://www.intel.com.Company H1B Sponsorship
Intel has a track record of offering H1B sponsorships, with 239 in 2026, 2793 in 2025, 3717 in 2024, 3576 in 2023, 4811 in 2022, 3359 in 2021, 1174 in 2020. Please note that this does not guarantee sponsorship for this specific role.